In the semiconductor and microelectronics industries, ozone water cleaning is gradually replacing conventional chemical cleaning. Ozone water cleaning offers higher cleanliness, requires no hazardous chemical post-treatment, and reduces cost and makes the equipment environment safer (avoiding the corrosion caused by long-term use of strong acids) while maintaining existing process performance. Thanks to its strongly oxidizing nature, ozone water can powerfully remove photoresist during wafer cleaning and oxidize elemental metals into soluble ions, and can replace conventional SC-1 (ammonia / hydrogen peroxide / water), SC-2 (hydrochloric acid / hydrogen peroxide / water) and SPM (sulfuric acid / hydrogen peroxide) cleaning processes for removing organic matter and particles.
Generates bubble-free, ultra-high-purity ozone water with a concentration of up to 200 ppm
Ozone water concentration and flow rate can be adjusted dynamically
e-PTFE membrane tubes intercept particulate contamination
Perfluoro structure for high cleanliness and stable performance
Inlet water pressure (WEP) > 0.40 MPa
Address：Building 5, Shengao Science and Technology Innovation Park, No. 1666 Zhixing Road, Xiaoshan District, Hangzhou City, Zhejiang Province
Mobile：13927334629 13923623980
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